• AN900 APPLICATION NOTE

    raw wafer. Wafer diameters are typically 125, 150 or 200 mm (5, 6 or 8 inches). However raw pure silicon has a main electrical property: it is an isolating material. So some of the features of silicon have to be altered, by means of well controlled processes. This is obtained by "doping" the silicon.

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  • Video: Wafer Processing using SWAM® C5100 Crystal Mark ...

    The SWAM C5100 is a fully automated system for silicon wafers processing. It can be configured for the wafer parameters, and after that the process can be automated for consistent, repeatable results. The wafer is placed on a rotary vacuum chuck surrounded by a nest.

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  • G2 Automated Technologies, LLC : WAFER HANDLING ...

    Wafering tool supplier Silicon Genesis Corp (SiGen) of San Jose, CA, USA, which was founded in 1997 to provide engineered substrate process technology for the semiconductor, display, optoelectronics and solar markets, has finalized the specifications of its secondgeneration production system.

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  • Wafer Handling and Cleaning

    Standard Silicon Wafer Grades • Mechanical grade – Only the dimensions are controlled ... types of processing equipment. To index the cassette to the handler, an ... – Place wafers in process (WIP) face down in wafer trays while in between processing steps.

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  • How do they make Silicon Wafers and Computer Chips ...

    Mar 05, 2008· It was about using synthetic diamond crystal in place of silicon as the chip substrate. Since diamond crystal can tolerate higher heat, a CPU can be overclocked without the worry of a .

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  • Semiconductor Processing Equipment | LEL International

    Front End Semiconductor Processing. The front end of semiconductor processing entails wafer fabrication, whereas the back end of semiconductor processing is concerned with assembly. In the front end process, the silicon chip is tested, in an action known as wafer probing.

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  • SEMI® Semiconductor Materials Market Information |

    This analysis covers silicon wafer reclaim for the semiconductor market. Reclaim is defined as the removal of several microns of the silicon wafer and subsequent repolishing of the wafer surface. Market estimates for reclaim wafers include semiconductor applications including equipment and IC manufacturing markets.

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  • SEMICONDUCTOR EQUIPMENT Addison Engineering

    Addison Engineering s a leading supplier of silicon wafers, silicon wafer processing, semiconductor process, test, and assembly equipment, silicon wafer operations management, ceramic packages and related semiconductor materials and services.

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  • Semiconductor Wafers Wafer Processing | CoorsTek

    CoorsTek engineered technical ceramics are ideal for semiconductor wafer processing applications, including epitaxial growth processing and single crystal pulling. In addition to manufacturing carbon graphite susceptors and quartz crucibles, CoorsTek GaNonSi epiwafers provide a lower cost option for developing smaller, faster and cooler power ...

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  • Keep an eye on wafer defects | EDN

    Semiconductor process engineers have always understood the need to inspect silicon wafers to identify defects and eliminate them at their source. To simplify the process, semiconductor equipment manufacturers routinely place inspection systems on production .

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  • The Evolution of Silicon Wafer Cleaning Technology

    The purity of wafer surfaces is an essential requisite for the successful fabrication of VLSI and ULSI silicon circuits. Wafer cleaning chemistry has remained essentially unchanged in the past 25 years and is based on hot alkaline and acidic hydrogen peroxide solutions, a process known as "RCA Standard Clean."

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  • About Silicon Wafers | SUMCO CORPORATION

    Behind the rapid advance and spread of the semiconductor devices used in this equipment is the success in developing silicon wafers offering higher quality and lower cost. We are continuing to carry out silicon wafer research and development to make our future even brighter and more convenient.

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  • Silicon Wafer Processing | Semefab

    Semefab is an experienced silicon wafer foundry and as such we are accustomed to developing, optimizing and inducting customerspecific solutions in a timely and costeffective manner. With an extensive process portfolio Semefab specializes in

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  • Ultraclean Surface Processing of Silicon Wafers

    too much to say that the process equipment and processes themselves are the source of the contamination. For this reason, making the total VLSI process cleaner that is, preventing contamination from the surface of silicon wafers and maintaining clean surface in the full range of processes has become even more essential.

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  • How silicon is made material, making, history, used ...

    Silicon's compounds are also found in water, in the atmosphere, in many plants, and even in certain animals. Silicon is the fourteenth element of the periodic table and is a Group IVA element, along with carbon germanium, tin and lead. Pure silicon is a dark gray solid with the same crystalline structure as .

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  • Conformal Coating Removal: Videos, Equipment Crystal ...

    Crystal Mark is able to develop custom processes for precise, selective conformal coating removal (CCR). The team is able to guide customers to select the right equipment that would allow them to achieve the desire results maximizing advantage of the SWAM Blaster® technology.

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  • WAFER PROCESSING EQUIPMENT, SILICON WAFER .

    Solitec Wafer Processing produces a wide array of wafer processing equipment, semiconductor processing machines. Solitec's product line includes Spin Systems, Vapor Prime/Bake Modules, Mask Aligners, and Quartz Cleaning Systems.

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  • Thin Wafer Processing and Dicing Equipment Market i ...

    Thin Wafer Processing and Dicing Equipment Market Home | Reports Monitors ... below 100 μm silicon wafers become very flexible and challenging to thin down further using only standard grinding methods due to stress in high volume manufacturing production. ... The TAIKO process is a new wafer back grinding method developed by DISCO. It is one ...

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  • Revasum | About | CMP Grinding Technologies

    OUR WAFER PROCESSING PORTFOLIO. At Revasum, we support a portfolio of production proven, reliable wafer processing equipment for device and substrate manufacturing. Following is a short introduction to CMP, Grinding, and Substrate Manufacturing.

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  • Panasonic opens "Plasma Dicing Demonstration Center ...

    Oct 12, 2016· The center is established to promote a new plasma dicing process to dice silicon wafers thinned to 25μm, which is half the thickness of current memory products. The center's clean room is showcasing a vertically integrated processing and inspection equipment dedicated for supporting the plasma dicing process.

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